JPH0433804B2 - - Google Patents
Info
- Publication number
- JPH0433804B2 JPH0433804B2 JP2578886A JP2578886A JPH0433804B2 JP H0433804 B2 JPH0433804 B2 JP H0433804B2 JP 2578886 A JP2578886 A JP 2578886A JP 2578886 A JP2578886 A JP 2578886A JP H0433804 B2 JPH0433804 B2 JP H0433804B2
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- epoxy
- resin
- present
- maleimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Processes Of Treating Macromolecular Substances (AREA)
- Epoxy Resins (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2578886A JPS62184014A (ja) | 1986-02-10 | 1986-02-10 | 耐熱性,電気絶縁性にすぐれた硬化物を与える樹脂組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2578886A JPS62184014A (ja) | 1986-02-10 | 1986-02-10 | 耐熱性,電気絶縁性にすぐれた硬化物を与える樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62184014A JPS62184014A (ja) | 1987-08-12 |
JPH0433804B2 true JPH0433804B2 (en]) | 1992-06-04 |
Family
ID=12175568
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2578886A Granted JPS62184014A (ja) | 1986-02-10 | 1986-02-10 | 耐熱性,電気絶縁性にすぐれた硬化物を与える樹脂組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62184014A (en]) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5305582B2 (ja) * | 2006-11-08 | 2013-10-02 | 株式会社日本触媒 | ラジカル重合性樹脂および樹脂組成物 |
WO2015016323A1 (ja) * | 2013-07-31 | 2015-02-05 | ミネベア株式会社 | 熱硬化性樹脂組成物及び摺動部材、並びに摺動部材の製造方法 |
JP6601634B2 (ja) * | 2017-03-31 | 2019-11-06 | 協立化学産業株式会社 | 変性樹脂及びそれを含む硬化性樹脂組成物 |
CN116285344B (zh) * | 2021-12-20 | 2024-05-14 | 无锡创达新材料股份有限公司 | 一种耐高温半导体封装用的热固性树脂组合物及其制备方法 |
CN116285345B (zh) * | 2021-12-20 | 2024-05-14 | 无锡创达新材料股份有限公司 | 一种热固性树脂组合物在封装第三代半导体材料中的应用 |
-
1986
- 1986-02-10 JP JP2578886A patent/JPS62184014A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS62184014A (ja) | 1987-08-12 |
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